創新科技署
電子工程師／機電工程師
Electronics Engineer / Electrical and Mechanical Engineer
月薪港幣52,000元至60,000元，視乎學歷及經驗而定
職責
電子工程師（非公務員合約）／機電工程師（非公務員合約）主要協助高級工程師負責以下工作－
(a) 就電子／機電相關範疇提供技術意見及支援；
(b) 審閱和評估創新及科技基金下的項目建議書，並監察獲批項目的進度；
(c) 為創新及科技基金轄下各評審委員會提供秘書處服務及技術支援；
(d) 擬定用以徵求創新及科技基金申請項目的目標主題；
(e) 監察本地及海外業界的科技發展；
(f) 建立電子／機電相關科技知識庫；以及
(g) 執行與推動創新及科技發展有關的其他職務。
(a) 就電子／機電相關範疇提供技術意見及支援；
(b) 審閱和評估創新及科技基金下的項目建議書，並監察獲批項目的進度；
(c) 為創新及科技基金轄下各評審委員會提供秘書處服務及技術支援；
(d) 擬定用以徵求創新及科技基金申請項目的目標主題；
(e) 監察本地及海外業界的科技發展；
(f) 建立電子／機電相關科技知識庫；以及
(g) 執行與推動創新及科技發展有關的其他職務。
The Electronics Engineer (Non-Civil Service Contract) /Electrical and Mechanical Engineer (Non-Civil Service Contract) is mainly deployed to assist the Senior Engineer in
(a) providing technical advice and support on the electronics/ electrical and mechanical related fields;
(b) examining and evaluating project proposals and monitoring the progress of approved projects under the Innovation and Technology Fund;
(c) providing secretariat and technical support to assessment panels under the Innovation and Technology Fund;
(d) developing themes for solicitation of applications under the Innovation and Technology Fund;
(e) monitoring the technological development of the local and overseas industries;
(f) building up a knowledge base on the electronics/ electrical and mechanical related technology; and
(g) performing other duties in relation to promotion of innovation and technology.
(a) providing technical advice and support on the electronics/ electrical and mechanical related fields;
(b) examining and evaluating project proposals and monitoring the progress of approved projects under the Innovation and Technology Fund;
(c) providing secretariat and technical support to assessment panels under the Innovation and Technology Fund;
(d) developing themes for solicitation of applications under the Innovation and Technology Fund;
(e) monitoring the technological development of the local and overseas industries;
(f) building up a knowledge base on the electronics/ electrical and mechanical related technology; and
(g) performing other duties in relation to promotion of innovation and technology.
入職條件
申請人須－
(a) 持有本港大學頒授的電子工程、電機工程、工業工程、機械工程、製造工程、資訊工程、電腦工程或電腦科學一級或二級榮譽學士學位，或具備同等學歷；如持有相關學科的更高學歷則更佳[見註(1)及註(2)]；
(b) 於取得上述學歷後，在電子／機電相關行業的最新科技發展方面具有最少六年全職工作經驗；如具備評審相關範疇項目的技術及商業價值和管理項目運作的經驗，可獲優先考慮[見註(3)]；
(c) 如具備下述範疇最新發展的知識則更佳，包括(i)電子應用程式的管理、設計、支援、質素保證和推行；(ii)裝置、組裝、半導體或超淨室程序；(iii)超大規模集成電路或電力電子電路及系統；(iv)無線通訊科技；(v)光子學；(vi)影像及感應科技；(vii)人工智能；(viii)資訊及通訊科技；(ix)綠色科技；(x)機械人科技；或(xi)工業系統及自動化；
(d) 如為1975年12月5日之後選出的香港工程師學會（電機或機械、電子、資訊或生物醫學界別）正式會員，或具備同等資格，可獲優先考慮；
(e) 具備良好的中英文書寫傳意技巧，能操流利粵語和英語，並在香港中學文憑考試或香港中學會考中國語文科及英國語文科考獲第2級或以上成績，或具同等成績[見註(2)及註(4)]；以及
(f) 辦事條理分明、責任感強，並具備與各級人員相處的良好人際及溝通技巧。
(a) 持有本港大學頒授的電子工程、電機工程、工業工程、機械工程、製造工程、資訊工程、電腦工程或電腦科學一級或二級榮譽學士學位，或具備同等學歷；如持有相關學科的更高學歷則更佳[見註(1)及註(2)]；
(b) 於取得上述學歷後，在電子／機電相關行業的最新科技發展方面具有最少六年全職工作經驗；如具備評審相關範疇項目的技術及商業價值和管理項目運作的經驗，可獲優先考慮[見註(3)]；
(c) 如具備下述範疇最新發展的知識則更佳，包括(i)電子應用程式的管理、設計、支援、質素保證和推行；(ii)裝置、組裝、半導體或超淨室程序；(iii)超大規模集成電路或電力電子電路及系統；(iv)無線通訊科技；(v)光子學；(vi)影像及感應科技；(vii)人工智能；(viii)資訊及通訊科技；(ix)綠色科技；(x)機械人科技；或(xi)工業系統及自動化；
(d) 如為1975年12月5日之後選出的香港工程師學會（電機或機械、電子、資訊或生物醫學界別）正式會員，或具備同等資格，可獲優先考慮；
(e) 具備良好的中英文書寫傳意技巧，能操流利粵語和英語，並在香港中學文憑考試或香港中學會考中國語文科及英國語文科考獲第2級或以上成績，或具同等成績[見註(2)及註(4)]；以及
(f) 辦事條理分明、責任感強，並具備與各級人員相處的良好人際及溝通技巧。
Candidates should have –
(a) a 1st or 2nd class honours degree in electronics engineering, electrical engineering, industrial engineering, mechanical engineering, manufacturing engineering, information engineering, computer engineering or computer science from a Hong Kong university, or equivalent; a higher degree in relevant discipline is preferred [see Note (1) and (2)];
(b) at least six years’ full-time post-qualification experience in the latest technological development in the electronics/ electrical and mechanical related industry, experience in assessing the technical and commercial merits of projects in the relevant field and managing their operation is preferred [see Note (3)];
(c) knowledge in the latest development in (i) electronics application management, design, support, quality assurance and implementation; (ii) device, packaging, semiconductor or clean room procedures; (iii) Very large-scale integration (VLSI) or power electronic circuit and system; (iv) wireless communication technologies; (v) photonics; (vi) imaging and sensing technologies (vii) Artificial Intelligence; (viii) Information and Communication Technologies; (ix) Green Technology; (x) Robotics Technology; or (xi) Industrial System and Automation is preferred;
(d) Corporate Member of the Hong Kong Institution of Engineers (Electrical or Mechanical, Electronics, Information or Biomedical Disciplines) elected after 5 December 1975, or equivalent is preferred;
(e) good oral and written communication skills in Cantonese and English, with level 2 or above in both Chinese Language and English Language in the Hong Kong Diploma of Secondary Education Examination (HKDSEE) or Hong Kong Certificate of Education Examination (HKCEE), or equivalent [see Note (2) and (4)]; and
(f) well-organized, strong sense of responsibility, good interpersonal and communication skills with people at all levels.
(a) a 1st or 2nd class honours degree in electronics engineering, electrical engineering, industrial engineering, mechanical engineering, manufacturing engineering, information engineering, computer engineering or computer science from a Hong Kong university, or equivalent; a higher degree in relevant discipline is preferred [see Note (1) and (2)];
(b) at least six years’ full-time post-qualification experience in the latest technological development in the electronics/ electrical and mechanical related industry, experience in assessing the technical and commercial merits of projects in the relevant field and managing their operation is preferred [see Note (3)];
(c) knowledge in the latest development in (i) electronics application management, design, support, quality assurance and implementation; (ii) device, packaging, semiconductor or clean room procedures; (iii) Very large-scale integration (VLSI) or power electronic circuit and system; (iv) wireless communication technologies; (v) photonics; (vi) imaging and sensing technologies (vii) Artificial Intelligence; (viii) Information and Communication Technologies; (ix) Green Technology; (x) Robotics Technology; or (xi) Industrial System and Automation is preferred;
(d) Corporate Member of the Hong Kong Institution of Engineers (Electrical or Mechanical, Electronics, Information or Biomedical Disciplines) elected after 5 December 1975, or equivalent is preferred;
(e) good oral and written communication skills in Cantonese and English, with level 2 or above in both Chinese Language and English Language in the Hong Kong Diploma of Secondary Education Examination (HKDSEE) or Hong Kong Certificate of Education Examination (HKCEE), or equivalent [see Note (2) and (4)]; and
(f) well-organized, strong sense of responsibility, good interpersonal and communication skills with people at all levels.
入職條件(註)
(1) 申請人須在申請書上清楚註明其學位課程所修讀的主修和副修科目。申請人如有其他學歷（例如相關科目的更高學歷），亦須在申請書上一併列明。
(2) 填妥的申請書，連同(i)學歷資格證明書副本及(ii)香港中學文憑考試／香港中學會考／綜合招聘考試成績的副本，須於截止申請日期或之前（信封上的郵戳日期將視作申請日期）送達下述聯絡地址。
(3) 申請人另須提交履歷表，列明取得有關學歷後所具備的相關工作經驗及性質，亦須提供現時及過去受僱記錄的證明文件副本。
(4) 政府在聘任非公務員合約僱員時，2007年前香港中學會考中國語文科及英國語文科（課程乙）C級和E級的成績，在行政上會分別獲接納為等同2007年及之後香港中學會考中國語文科及英國語文科第3級和第2級的成績。
申請人如在截止申請日期或之前未能完全符合入職條件(a)、(b)和(e)任何一項，其申請將不獲受理。
(2) 填妥的申請書，連同(i)學歷資格證明書副本及(ii)香港中學文憑考試／香港中學會考／綜合招聘考試成績的副本，須於截止申請日期或之前（信封上的郵戳日期將視作申請日期）送達下述聯絡地址。
(3) 申請人另須提交履歷表，列明取得有關學歷後所具備的相關工作經驗及性質，亦須提供現時及過去受僱記錄的證明文件副本。
(4) 政府在聘任非公務員合約僱員時，2007年前香港中學會考中國語文科及英國語文科（課程乙）C級和E級的成績，在行政上會分別獲接納為等同2007年及之後香港中學會考中國語文科及英國語文科第3級和第2級的成績。
申請人如在截止申請日期或之前未能完全符合入職條件(a)、(b)和(e)任何一項，其申請將不獲受理。
